5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 package dimensions drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 1 hd-r/rd013 note: 1.all dimensions ar e in millimeters. 2.tolerance is 0.25mm(0.010 ") unless otherwise specified. 3.protruded resin under flange is 1.5mm(0.059 ") max. 4.lead spacing is measured where the leads emerge from the package. 5.specification are subject to change without notice 6.highlight <-500v the led can withstand the max static level when assemblin g or o p eration.
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 features * 5.0mm dia led lamp * low power consumption. * i.c. compatible. * three chips are matched for uniform light output. * long life-solidstate reliability. * full color and high contrast lamp chip materials * dice material : algainp/ga as & gainn/gan & gainn/gan * light color : full color(super red & ultra pure green & ultra blue) * lens color : water clear absolute maximum rating:(ta 25 c) symbol description super red ultra pure green ultra blue unit p ad power dissipation per chip 70 130 120 mw v r reverse voltage per chip 5 5 5 v i f average forward current per chip 30 30 30 ma i pf peak forward current per chip (duty=0.1,1khz) 60 120 70 ma - derating linear from 25c per chip 0.4 0.4 0.4 ma/c topr operating temperat ure range -25c to 85c tstg storage temperature range -40c to 85c lead soldering temperature 1.6mm(0.063 inch) from body 260c5c for 5 seconds electro-optical characteristics:(ta=25c) symbol parameter test condi tion min. typ. max. unit super red 1.8 2.2 v ultra pure green 3.5 4.0 v v f forward voltage i f =20ma ultra blue 3.5 4.0 v super red 100 a ultra pure green 100 a i r reverse current v r =5v ultra blue 100 a super red 625 nm ultra pure green 525 nm d dominant wavelength i f =20ma ultra blue 46 0 nm super red 20 nm ultra pure green 22 nm ? spectral line half-width i f =20ma ultra blue 30 nm super red 85................ 100 deg ultra pure green 85................100 deg 2 1/2 half intensity angle i f =20ma ultra blue 85................100 deg super red 310................435 mcd ultra pure green 770...............1080 mcd i v luminous intensity i f =20ma ultra blue 200................390 mcd drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 2 hd-r/rd014
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 3
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 y soldering method soldering conditions remark dip soldering bath temperature: 2605 immersion time: with 5 sec y solder no closer than 3mm from the base of the package y using soldering flux,? resin flux? is recommended. soldering iron soldering iron: 30w or smaller t emperature at tip of iron: 260 or lowe r soldering time: within 5 sec. y during soldering, take care not to press the tip of iron against the lead. (to prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) when soldering the lead of led in a condition that the pack age is fixed with a p anel (see fig.1), be careful not to stress the leads with iron tip. 2) when soldering wire to the lead, work with a fig (see fig.2) to avoid stressing the package. drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 4 p a n e l (fig.1) l e a d w r i e s l e a v e a s l i g h t c l e a r a n c e l e a d w r i e s (fig.2)
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 3) similarly, when a jig is used to solder the led to pc board, take care as much as possible to avoid steering the leads (see fig.3). 4) repositioning after soldering should be avoided as much as possible. if inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the led. 5) lead cutting after soldering should be performed only after the led temperature has returned to normal temperature. y led mounting method 1) when mounting the led by using a case, as shown fig.4, ensure that the mounting holds on the pc board match the pitch of the leads correct ly-tolerance of dimensions of the respective components including the led should be taken into account especially when designing the case, pc board, etc. to prevent pitch misa lignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. alternatively, the shape of the holes should be made oval. (see fig.4) drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 5 p c b o a r d ig.3 f jig fig.4 case pc board
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 2) use leds with stand-off (fig.5) or the tube or spacer made of re sin (fig.6) to position the leds. y formed lead 1) the lead should be bent at a point located at least 2mm away from the package. bending should be performed with base fixed means of a jig or pliers (fig.7) 2) forming lead should be carried our prior to so ldering and never during or after soldering. 3) form the lead to ensure alignment between t he leads and the hole on board, so that stress against the led is prevented. (fig.8) drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 6 stand-off fig.5 fig.6 tube 2 m m f i g . 7
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 y lead strength 1) bend strength do not bend the lead more than twice. (fig.9) 2) tensile strength (@ room temperature) if the force is 1kg or less, there will be no problem. (fig.10) y handling precautions although rigid against vibration, the leds may damaged or scratched if dropped. so take care when handling. y chemical resistance 1) avoid exposure to chemicals as it may at tack the led surface and cause discoloration. 2) when washing is required, refer to the follo wing table for the proper chemical to be sued. (immersion time: within 3 minutes at room temperature.) solvent adaptability freon te chlorothene w isopropyl alcohol thinner w acetone w trichloroethylene w --usable w --do not use. drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 7 fi g .9 ok fig.10 1kg note: influences of ultrasonic cleaning o f the led resin body differ depending on such factors as the oscillato r output, size of the pc board and the way in which the led is mounted. therefore, ultrasonic cleaning should only be performed after confirming there is no problem by
5.0 mm dia led lamp 599R2GBC-CA rev:a / 0 experiment item: test condition item lamp & ir reference standard operation life ta 25 5 if= 20ma rh =60%rh dynamic:100ma 1ms 1/10 duty static state: if 20ma test time: 168hrs -24hrs +24hrs 500hrs -24hrs +24hrs 1000hrs -24hrs +72hrs mil-std-750 1026 mil-std-883 1005 jis c 7021 b-1 high temperature high humidity storage ta 65 5 rh 90 ? 95%rh test time 240hrs 2hrs mil-std-202 103b jis c 7021 b-1 temperature cycling 105 ? 25 ? -55 ? 25 30min 5min 30min 5min 10cycles mil-std-202 107d mil-std-750 1051 mil-std-883 1010 jis c 7021 a-4 thermal shock 105 5 ? -55 5 10min 10min 10cycles mil-std-202 107d mil-std-750 1051 mil-syd-883 1011 solder resistance t sol 260 5 dwell time 10 lsec mil-std-202 210a mil-std-750-2031 jis c 7021 a-1 solderability t sol 230 5 dwell time 5 lsec mil-std-202 208d mil-std-750 2026 mil-std-883 2003 jis c 7021 a-2 drawing no. : ds-35-04-0637 date : 200 5-10-19 page : 8
|
